99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

Product Details
Customization: Available
CAS No.: 10125-13-0
Formula: Cl2cuh4o2
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Number of Employees
20
Year of Establishment
2020-03-20
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
  • 99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride
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Overview

Basic Info.

Model NO.
b tch 10125-13-0
EINECS
600-176-4
Purity
≥99%
Grade Standard
Industrial Grade
MW
170.48
Sample
Support
Appearance
Blue-Green
Storage
Yes
Transport Package
Bag
Specification
25kg
Trademark
Future Chemical
Origin
China
Production Capacity
1000ton

Product Description

Product Description

Copper(II) chloride dihydrate for electroplating additive cas 10125-13-0

Copper(II) chloride dihydrate Basic information 
Product Name: Copper(II) chloride dihydrate
CAS: 10125-13-0
MF: Cl2CuH4O2
MW: 170.48
EINECS: 600-176-4
Mol File: 10125-13-0.mol
Copper(II) chloride dihydrate Chemical Properties 
Melting point  100 °C (dec.)(lit.)
density  2.54
vapor density  >1 (vs air)
storage temp.  Store at RT.
solubility  757g/l
form  Solid
color  White
Specific Gravity 2.54
PH 3.0-3.8 (50g/l, H2O, 20ºC)
Water Solubility  1150 g/L
Sensitive  Air Sensitive & Hygroscopic
Merck  142,633
 
Item Index  
CuCl2•2H2O %≥ 96 98
Cu %≥ 35.3 36
Fe %≤ 0.02 0.02
Zn %≤ 0.02 0.02
SO42¯ %≤ 0.03 0.03
Water Insoluble %≤ 0.02 0.02
Product Categories
 

99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

Packaging & Shipping

99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

 

Company Profile
99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

 

Contact us

99% Purity Plating Additives CAS 10125-13-0 Copper (II) Chloride Dihydrate with Copper (II) Chloride

 

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